Capabilities
What the line can actually do.
Published as tables you can read, not a PDF you have to request. If your board sits outside this window, ask — we will tell you honestly whether it fits or whether you need a different shop.
Equipment
The line
| Machine | Detail |
|---|---|
| Solder paste printing | Fully automatic screen printer, ±12.5 µm alignment at 6 sigma and print repeatability at Cpk ≥ 2.0. Automatic squeegee and camera calibration, clamp pressure programmable per board so thin and warped panels print flat, and programmable wet–dry–vacuum stencil cleaning. Boards up to 500 × 400 mm. |
| Pick and place | High-speed modular placer for fine-pitch and standard packages, bought new. A second, older machine stays on the floor as backup, so one failure delays a build rather than stopping it. |
| Reflow | Two identical nitrogen-capable convection ovens, so a profile qualified on one runs on the other without requalifying — a job can move between them to hit a date. A smaller oven is kept as backup. These are the older machines on the line. |
| Through-hole soldering | Selective soldering cell for through-hole and mixed-technology boards, bought new. Point-by-point rather than wave, so a mixed board is not put through a full solder bath. |
| Inspection | 3D automated optical inspection at 15 µm, bought new, backed by manual inspection against IPC-A-610 Class 2. |
Most of the line was bought new within the last five years; the reflow ovens are older. Published from the plant's own equipment record, verified 5 September 2026.
Process window
Board and component limits
| Parameter | Limit |
|---|---|
| Maximum board size | 460 × 400 mm |
| Minimum board size | 50 × 50 mm |
| Smallest passive package | 0201 |
| BGA and QFN | Placed and reflowed. Joints are inspected by 3D AOI; we do not have X-ray, so a board that needs joint-level X-ray is not one for us. |
| Soldering processes | Lead-free (RoHS) and leaded |
| Workmanship standard | IPC-A-610 Class 2 unless you specify otherwise |
Board size is set by the tightest machine in the line, not the widest. Layer count, thickness and stack-up are set by the bare board, which is sourced to your specification — see below.
Materials
What we normally source
| Material | Standard | On request |
|---|---|---|
| Base material | FR-4 standard Tg | FR-4 high Tg, aluminium IMS, flex, rigid-flex, Rogers |
| Surface finish | Lead-free HASL | ENIG, OSP, immersion tin, immersion silver, hard gold |
| Soldermask | Green | Black, white, blue, red, yellow |
| Silkscreen | White | Black |
| Outer copper | 1 oz (35 µm) | 2 oz, 3 oz |
| Bare boards | Sourced to your stack-up | Your own fab, consigned |
Lead times and capacity
The date comes with the quote, because it depends on your bill of materials rather than on the line. Parts, not machine time, are almost always what sets it.
If your programme needs a reserved slot every month, say so and we will schedule it rather than quote it batch by batch.
Board outside the window? Ask anyway.
An engineer reads every request and answers honestly, typically within one business day.